碳化硅陶瓷复合材料与镍基高温合金的连接方法及接头
Patent Applicant:林铁松,杨佳,何鹏,林盼盼
Type of Patent:Software copyright
State of Patent:Have authorized
Service Invention or Not:no
Pre One:一种熔浸法烧结焊接方法
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