Joining SiCf/SiC composites to Al0.3CoCrFeNi high-entropy alloys with a Cu-Ti filler alloy: Interfacial reactions, high-entropy effects, and mechanical properties
Journal:Materials Science and Engineering: A
First Author:Jia Yang, Weihang Liu, Mengchun Fu, Jiawen Wen, Ke Li, Panpan Lin*, Ce Wang, Peng He*, Tiesong Lin*, Han Mei, Yue Liu
Translation or Not:no
Included Journals:SCI
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