yangfan Associate Professor
  

  • Education Level: PhD graduate

  • Degree: Doctor of engineering

  • Business Address: 西南交通大学信息楼1722

  • Professional Title: Associate Professor

  • Academic Titles: 研究生导师

  • Alma Mater: 西南交通大学

  • School/Department: 力学与航空航天学院

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    Language： 中文

    Paper Publications

    Hygrothermal failures from small defects in lead-free solder reflowed electronic packages

    Journal:Asia-Pacific EMC Week 2012 Asia-Pacific Symposium on Electromagnetic Compatibility Resorts World Sentosa

    Place of Publication:Singapore

    Co-author:Liao,Cheng,Yang,Dan

    First Author:Dou, Jiangling

    Document Code:636-640

    Volume:21

    Issue:24

    Translation or Not:no

    Date of Publication:2012-05-01

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