weiwenfu Associate Professor

  • Education Level: PhD graduate

  • Degree: Doctor of engineering

  • Gender: Male

  • Professional Title: Associate Professor

  • Alma Mater: 西安交通大学

  • Supervisor of Doctorate Candidates

  • Supervisor of Master's Candidates

  • School/Department: 电气工程学院

  • Discipline:Electrical Theory and New Technology
    Power Systems and Their Automation
    High Voltage and Insulation Technology
    Electrical Machinery and Appliances
    In Electrical Engineering
  • Honors and Titles:

    2020    主持完成国家自然科学基金,获结题“优秀”

    2020    获得黑龙江省技术发明奖一等奖

    2020    中国铁道学会科学技术奖一等奖

    2019    教育部科技进步奖 一等奖

    Language: 中文




    Research interests of Dr. Wenfu Wei are focused on the theory and technology of electrical engineering as well as advanced materials, especially in fields of power systems and electrified railway. He has won the first prize of the Science Progress Award of the Ministry of Education, and is the chairman of IEEE P2753 work group. He also is the co-chair of IEEE ICCS 2021 organization committee, and the guest editor of IEEE Transactions on Plasma Science. He undertook more than 10 scientific research projects such as the National Natural Science Foundation of China . He has published 2 academic monographs, more than 80 peer reviewed papers, 2 ESI high cited papers, 1 ESI hot paper, 1 IEEE TPS featured paper, more than 20 national patents and 3 software Copyrights.


    l   Chair of IEEE P2753, International Standards Working Group

    l   Member of IEEE P2771, International Standards Working Group

    l   Member of IEEE P2752, International Standards Working Group

    l   Secretary of CIGRE B2 China Special Committee

    l   Session Chair of IEEE ICEMPE 2021

    l   Session Chair of IEEE Electrical Insulation and Dielectric Phenomena

    l   Member of Technical Program Committee of  IEEE CEIDP

    3)     HONERS  and Awards

    l   National Railway Youth Science and Technology Innovation Award

    l   China Ministry of Education Award for Science and Technology Progress, First Prize Granted by the Ministry of Education of China

    l Excellent paper of high Voltage Professional Committee annual Conference Granted by the Chinese Society of Electrical Engineering

    l   Core member of the national innovation team in key areas Granted by the Ministry of Science and Technology of China 

    l   To guide the graduate students to win the excellent thesis of the Conference Granted by the Chinese Society of Electrical Engineering

    l   Excellent paper of high Voltage Professional Committee annual Conference Granted by the Chinese Society of Electrical Engineering

    l   As the chairman of the high Voltage annual conference branch to make a invited presentation Granted by the Chinese Society of Electrical Engineering 

    l   Excellent Paper award at high Voltage and Discharge Plasma Conference Granted by the Chinese Society of Electrotechnics

    Recent published articles:

    1.         Wei W, Li X, Yang Z, Huang Z, Zuo H, Liao Q, et al. Highly conductive graphite matrix/copper composites by a pressureless infiltration method. J Appl Phys 2021;130(1):015102.

    2.         Liao QH, Wei WF*, Zuo HZ, Li XB, Yang ZF, Xiao S, et al. Interfacial bonding enhancement and properties improvement of carbon/copper composites based on nickel doping. Compos Interfaces 2021;28(6):637-49. (ESI Highly cited paper, top1%and ESI hot paper, top0.1%)

    3.         Yang Z, Xu P, Wei WF*,, et al. Influence of the Crosswind on the Pantograph Arcing Dynamics. IEEE Trans Plasma Sci 2020:1-9. ESI Highly cited paper, top 1%, and IEEE TPS featured paper

    4.         Zhao LH, Wei CM, Li ZH, Wei WF, Jia LC, Huang XL, et al. High-temperature dielectric paper with high thermal conductivity and mechanical strength by engineering the aramid nanofibers and boron nitride nanotubes. Materials & Design. 2021;210:12.

    5.         Wei WF, Li XB, Yang ZF, Zuo HZ, Huang ZL, Liao QH, et al. Infiltration behavior of copper melt into porous graphite and saturation improvement by WC particles doping. Compos Interfaces 2021:17.

    6.         Deng Q, Wei WF*, Yin GF, Xie WH, Huang ZL, Ren JW, et al. The effect of thermal shock temperature difference on the structural, dynamics and mechanical properties of carbon materials characterized by ultrasonic test technology. Journal of Materials Science. 2021;56(33):18522-33.

    7.         Zuo HZ, Wei WF*, Yang ZF*, Li XB, Ren JW, Xian Y, et al. Performance enhancement of carbon/copper composites based on boron doping. J Alloys Compd 2021;876:9.

    8.         Zuo HZ, Wei WF*, Yang ZF, Li XB, Xie WH, Liao QH, et al. Synchronously improved mechanical strength and electrical conductivity of Carbon/Copper composites by forming Fe3C interlayer at C/Cu interface. Materials Today Communications. 2021;28.

    9.         Zuo HZ, Wei WF*, Li XB, Yang ZF, Liao QH, Xian Y, et al. Enhanced wetting and properties of Carbon/Copper composites by Cu-Fe alloying. Compos Interfaces 2021.

    10.      Wei WF, He S, Yang ZF, Wang S, Mei GM, Gao GQ, et al. Electromechanical efficiency improvement of the surface DBD by composite dielectric. Aip Advances. 2019;9(4):7

    mobile phone:13281897028;wechat:wwf13281897028; email:wfwei@home.swjtu.edu.cn 

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