Supervisor of Master's Candidates
钱林茂,徐乐,余丙军,郭剑,陈磊. “一种单晶硅表面划痕损伤层厚度的检测方法”
Affilication of Author(s):计算机与人工智能学院
Teaching and Research Group:计算机
Type of Patent:Software copyright
State of Patent:受理
Application Number:202211662617.0
Service Invention or Not:no
Application Date:2022-12-23
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