Advances in High-Temperature Sensor Technologies: Material System, Sensing Principles, Drift Compensation, and Encapsulation Reliability

Impact Factor:4.3

DOI number:10.1021/acsomega.5c08859

Affiliation of Author(s):西南交通大学

Teaching and Research Group:微纳制造及智能传感技术

Journal:ACS Omega

Funded by:National Natural Science Foundation of China (52575673, 52375578)

Abstract:High-temperature sensors are irreplaceable for extreme-environment monitoring in aerospace, automotive, marine, and industry applications. This review synthesizes critical advances in materials, sensing principles, drift compensation, signal transmission, and encapsulation reliability. We analyze high-temperature-resistant ceramics, metals, crystalline materials, wide-band gap semiconductors, and high-entropy alloys, highlighting their operational mechanisms under high-temperature conditions. Subsequently, seven typical high-temperature sensing principles including fiber Bragg grating, LC resonance, Hall effect, magnetostriction, piezoelectric effect, Seebeck effect, and thermoelectric effect are expounded. Furthermore, the roles of software compensation strategies (curve fitting and neural networks) and hardware compensation approaches (material optimization and circuit design) in suppressing temperature drift are discussed. In addition, the thermomechanical reliability design of packaging technologies such as high-temperature tubular encapsulation, solid-state isolation encapsulation, substrate encapsulation, and leadless encapsulation is comprehensively reviewed. Finally, the operational performance of high-temperature sensors in high-temperature scenarios, such as automotive powertrains, aircraft engines, and marine turbines, is detailed. This review provides theoretical guidance and technical references for material selection, sensing principle innovation, and engineering implementation of high-temperature sensors.

Co-author:Bin Song,Yucong Mao,Zhi-jun Zhao,Bingjun Yu,Linmao Qian

First Author:Xihong Huang

Indexed by:SCI

Correspondence Author:Hongbo Wang

Discipline:Engineering

Document Type:J

Volume:11

Issue:4

Page Number:4843–4867

Translation or Not:no

Date of Publication:2026-01-21

Included Journals:SCI

Links to published journals:https://pubs.acs.org/doi/full/10.1021/acsomega.5c08859