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晶圆级单层胶体晶体自组装关键技术与成套装备的研究与产业化
Affiliation of Participant(s):苏州微之纳智能科技有限公司
Status:在研
Supported by:江苏省昆山市科学技术局
Supported by:昆山市创新创业人才项目
Classification of Disciplines:Engineering
Date of Project Completion:2023-06-30
Date of Project Initiation:2020-07-01
Subsidy Amount:100.0
Pre One:2D电磁-化学耦合增强SERS基底的设计、加工和增强机制研究
Next One:面向中高端传感器的百纳米量级单层胶体晶体自组装方法及机理研究