DOI number: 10.15938/j.emc.2021.12.003
Journal: 电机与控制学报
Key Words: 伺服电机，多轴伺服驱动，矢量控制，多处理器片上系统，现场可编程门阵列，软硬件协同设计
Co-author: 王东,许睿,张文轩,刘庆想
First Author: 王邦继
Discipline: Engineering
Volume: 25
Issue: 12
Page Number: 19-26
ISSN No.: 1007-449X
Translation or Not: no
CN No.: 23-1408/TM
Date of Publication: 2021-12-01
Included Journals: EI
Links to published journals: https://kns.cnki.net/kcms2/article/abstract?v=3uoqIhG8C44YLTlOAiTRKibYlV5Vjs7iJTKGjg9uTdeTsOI_ra5_XS3Cxv1BSt47rtZc3lCIvvmg9flCH0_aKlQ3z3bveU9t&uniplatform=NZKPT