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一种高致密低电阻ITO靶材的微波掺杂烧结方法

Type of Patent: Software copyright

State of Patent: Authorized patents

Application Number: CN201310156685.4;CN201300010156685

Authorization number: CN103232234A;CN2013103232234A

Number of Inventors: 10

Service Invention or Not: no

Application Date: 2013-04-28

Publication Date: 2013-08-07

First Author: 汪建新 陈迪 姜崇喜 孙红亮 冯波 鲁雄 翁杰 屈树新 卢晓英 段可