Adaptive polishing path optimization for free-form uniform polishing based on footprint evolution

影响因子：3.4

DOI码：10.1007/s00170-024-12996-z

所属单位：西南交通大学

教研室：机械工程学院

发表刊物：The International Journal of Advanced Manufacturing Technology

摘要：Polishing path optimization plays a crucial role in achieving high-quality and uniform surface polishing of free-form surfaces. To address the issue of uncontrollable ripple errors caused by uneven material removal in traditional contact polishing, this paper proposes an adaptive polishing path optimization method for uniform polishing of free-form surfaces based on footprint evolution. The presented approach considers the influence of curvature on footprint evolution and seeks to dynamically optimize the spacing between adjacent paths. This optimization ensures suitable overlap between neighboring footprints, ultimately leading to the achievement of uniform depth removal. Through modeling simulations and experimental comparisons involving different contact curvatures, it has been conclusively established that surface curvature plays a pivotal role in footprint evolution. Additionally, surface polishing experiments yielded results indicating a reduction in surface waviness within the central polishing area, decreasing from a root-mean-square value of 5.1766 to 4.1448 nm. These outcomes preliminary demonstrate the effectiveness of the proposed method. This study presents an efficient curvature adaptive path planning approach based on footprint evolution, offering new insights into achieving uniform polishing and suppressing waviness errors on free-form surfaces. © 2024, The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature.

论文类型：EI

卷号：130

期号：9-10

页面范围：4311-4324

是否译文：否

发表时间：2024-01-16

收录刊物：EI

发布期刊链接：https://link.springer.com/article/10.1007/s00170-024-12996-z