硕士生导师
个人信息Personal Information
教师英文名称：Hongbo Wang
入职时间：2022-06-29
学历：博士研究生毕业
学位：工学博士学位
办公地点：西南交通大学犀浦校区3号教学楼31719房间
性别：男
在职信息：在岗
主要任职：智能制造与装备系主任助理
其他任职：智慧城市与交通学院本科教学秘书
毕业院校：西南交通大学
学科：机械制造及其自动化
所在单位：城市轨道交通学院（智慧城市与交通学院）
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Dispersive atomization-assisted self-assembly: Vapor-phase direct-write of conformal colloidal monolayers on arbitrary 3D surfaces
影响因子：5.4
DOI码：10.1016/j.colsurfa.2026.142084
所属单位：西南交通大学
教研室：智能制造与装备系
发表刊物：Colloids and Surfaces A: Physicochemical and Engineering Aspects
关键字：Dispersive atomization-assisted self-assembly; Air-liquid interface assembly; Conformal monolayers; Defect annealing; PS and PMMA nanoparticles
摘要：The scalable fabrication of large-area, defect-minimized monolayer colloidal crystals remains a critical bottleneck for their deployment in nanophotonics, multimodal sensing, and soft robotics. Conventional bottom-up approaches are plagued by coffee-ring effects, shear-induced cracking, multilayer stacking, and poor geometric adaptability, particularly on non-planar substrates. Here, we report dispersive atomization-assisted self-assembly (DAASA), a robust and low-cost strategy that enables wafer-scale production of highly ordered, near-defect-free monolayers. In contrast to previously reported aerosol-assisted assembly, in which particles are supplied continuously and ordering must keep pace with an uninterrupted flux, DAASA meters the aerosol in short pulses separated by quiescent intervals; delivery and assembly are therefore decoupled in the time domain, and each dose is followed by a defined window for capillary-driven defect annealing. By decoupling particle delivery from interfacial assembly, DAASA leverages precisely controlled aerosol deposition onto an air-liquid interface, where capillary forces and tuned colloidal interactions drive spontaneous long-range ordering. Systematic optimization of substrate wettability, ionic strength, solvent surface tension, and, critically, an intermittent atomization protocol yields high film uniformity and crystallinity. Most notably, and in contrast both to strategies that order the particles on the target surface itself and to those that require a post-assembly transfer, DAASA transcends planar geometries: it achieves transfer-free, conformal monolayers directly on complex 3D curved surfaces via a vapor-phase direct-write mechanism, eliminating both liquid immersion and post-assembly transfer. This gentle, non-destructive nanomanufacturing paradigm opens transformative pathways for structural color, metasurfaces, wearable sensors, and bioinspired soft systems.
合写作者：黄熙鸿,毛宇聪,童瑜,张艺凡,赵志俊,余丙军,钱林茂
第一作者：宋斌
论文类型：SCI
通讯作者：汪红波*
论文编号：142084
学科门类：工学
文献类型：J
卷号：753
页面范围：142084
ISSN号：0927-7757
是否译文：否
发表时间：2026-09-03
收录刊物：SCI
发布期刊链接：https://www.sciencedirect.com/science/article/pii/S0927775726026245?dgcid=author